Dongguan Fodor Technology Co., Ltd
"Rich quality & leading future"
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| Raw Material | AL1050 |
| Custom Service | Yes, OEM/ODM Service |
| Quality System | ISO9001:2015 |
| Processing Technology | Cutting/Wood machining/CNC/Riveting |
| Surface treatment | Plating nickel |
| Packing Way | Blister packaging or special packing you would like |
| Application Scenario | Electronic equipment heat sink |
| MOQ Request | 100/500/1000 |
A cold plate is responsible for taking the heat from the device(s) and transferring it to a single-phase liquid coolant, circulating through internal channels of the plate and subsequently rejecting it downstream to a radiator. There are several thermal/mechanical advantages of a cold plate solution. .
Note
Liquid heat sinks are also called water-cooled radiators and liquid-cooled radiators. They are generally made of aluminum and used to dissipate heat. They are mainly used in high-power devices, such as servers, inverters, inverters, APF, SVG, IGBTs, etc., remember to have A company called Fodor Radiator Factory specializes in aluminum radiators, water-cooling plates, etc. This will install the heating element on the water-cooling plate to dissipate heat, and the internal liquid is specially designated.
Fodor designs and provides system-level thermal solutions. Cold plates used in conjunction with a pump, heat exchanger, heat sink, and liquid lines, comprise a typical pumped liquid cooling loop. Pumped liquid cooling systems have been used in numerous applications including automotive engine cooling, avionics thermal control and nuclear reactor cooling. In many cases, reservoirs and valves are used to control the fluid volume and flow rate. The pump circulates the fluid in the loop, which picks up the heat in the cold plate and dissipates the heat through the heat exchanger.
Our team of thermal experts has been developing advanced liquid cooling technologies that are capable of addressing complex issues with conventional liquid cooling technologies. The goal of our efforts is to advance the liquid cooling technologies to be able to cool very high-heat fluxes with minimal pressure drop penalty. In particular, Fodor’s R&D efforts in this area of advanced technologies for a diverse range of applications including, cooling of high-power, power electronics and computer microprocessors or data center cooling.
In addition to understanding traditional fluid/material compatibility, Fodor has developed several coatings to increase corrosion resistance in certain materials.
From design to manufacturing, component or system-level, Fodor’s Thermal Experts provide custom solutions from a proven partner. If you’d like more information about our custom cold plate design and manufacturing process, contact us!
When designing the heat dissipation of the water-cooling plate, it is necessary to provide the model of the water-cooling plate (that is, the size of the water-cooling plate), the drilling position of the water-cooling plate, the target to be achieved (including temperature difference, water pressure difference, etc.), the parameters of the joint, the power of the heat source, and Calorific value and other data
When designing a cold plate there are several challenges to overcome in order to create an optimal design. In many cases, there are trade-offs between design options.Fodor has significant experience in meeting thermal needs while minimizing operating and manufacturing costs. Below are several key performance features we will analyze as part of the design:
There are several types of cold plate systems for consideration. Fodor will analyze the design requirements and recommend the proper type of cold plate for your application. Below are several of our flow options:
Serpentine Tube
Each type of system configuration has performance trade-offs. For instance, a microchannel design increases surface area for heat transfer, however, with certain flow rates, it could cause flow instability and large pressure drops.
Envelope material and fluid compatibility are crucial considerations when designing a cold plate. The team at ACT has expertise in stable compatible solutions.
---Aluminum
---Stainless Steel
---Copper
---Polymer-Based
---Water
---Deionized Water
---Water / Ethylene Glycol mixture
---Dielectric Fluids
Envelope material and fluid compatibility are crucial considerations when designing a cold plate. The team at ACT has expertise in stable compatible solutions.
Aluminum
Stainless Steel
Copper
Polymer-Based
Water
Deionized Water
Water / Ethylene Glycol mixture
Dielectric Fluids
Once the design has been completed, it can be prototyped and manufactured in our IS0 9001:2008 and AS9100:2009 quality certified manufacturing facility. You can be confident of the very best design and manufacturing practices from Fodor.
Once the design has been completed, it can be prototyped and manufactured in our IS0 9001:2008 and AS9100:2009 quality certified manufacturing facility. You can be confident of the very best design and manufacturing practices from Fodor.
We can offer the design and simulation service. For example, our German customer's case.
According to the simulation results,the simulated chip is in compliance with the temperature requirements specficied by customer.
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